Tender Detail

Tender Details

  • Company BONGA UNIVERSITY
  • Address , Phone: +251474524588
  • Website
  • Deadline05 Mar 2024, 12:00 PM
  • magazineEGP
  • CountryEthiopia
  • Official noticeproduction.egp.gov.et
  • Bid Document PriceNot stated in the notice
  • Bid Security100000
  • opening date2024-03-05 12:30:00
  • Categories Engineering Service

Electrical Engineering Lab Material

BONGA UNIVERSITY


Tender Information

TitleElectrical Engineering Lab Material
DescriptionElectrical Engineering Lab Material
Procuring EntityBONGA UNIVERSITY
Reference NoBU-NCB-G-0024-2016-BID
Procurement MethodOpen
Submission Deadline2024-03-05 12:00:00
Invitation Date2024-02-13 09:00:00
Procurement TypeBidding
Award Typesingle envelop

Contact Information

Physical Address:kafa, Room 1st
bonga, Ethiopia
Contact Details:Tel: +251 474524588
Email: teshotes.04@gmail.com
Mailing Address:P.O. Box 334, Postal Code: 334

Bid Security

Amount: 100000 ETB

SME Bid Security Form: Letter_from_Small_and_Micro_Enterprise

Local Bidders Form: Bank_Guarantee

Terms and Conditions

N/A
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